MOSFET High Power Heated Bed Expansion Power Module

MOSFET High Power Heated Bed Expansion Power Module
https://bogza.ro/index.php/MOSFET_High_Power_Heated_Bed_Expansion_Power_Module

MOSFET High Power Heated Bed Expansion Power Module

MOSFET High Power Heated Bed Expansion Power Module

MOSFET High Power Heated Bed Expansion Power Module

Specifications

1. Colour: Black 2. Maximum current: 25A (enhanced heat dissipation) 3. Size: about 6 x 5 x 3.1cm 4. Mounting holes: 3.2mm diameter, for M3 screws

Features

- This module is positioned between the output of the heating bed or extruder and your electronic board as shown in the wiring diagram. - The white connector cable is provided. - With this additional module, the maximum current on the board can reach 25A. - This module is recommended if you plan to use a heated bed with a 3D printer that uses a 12V power supply.

Content

Simple - 1 MOSFET

               - 1 Cable

Double - 2 MOSFET

               - 2 Cables
               - 2 Nozzles 0.4mm for wire of 1.75mm

Package Included: [[1]]