MOSFET High Power Heated Bed Expansion Power Module
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| MOSFET High Power Heated Bed Expansion Power Module |
|
| https://bogza.ro/index.php/MOSFET_High_Power_Heated_Bed_Expansion_Power_Module | |
Specifications
- Colour: Black
- Maximum current: 25A (enhanced heat dissipation)
- Size: about 6 x 5 x 3.1cm
- Mounting holes: 3.2mm diameter, for M3 screws
Features
- This module is positioned between the output of the heating bed or extruder and your electronic board as shown in the wiring diagram.
- The white connector cable is provided.
- With this additional module, the maximum current on the board can reach 25A.
- This module is recommended if you plan to use a heated bed with a 3D printer that uses a 12V power supply.
Package Included: [[1]]