MOSFET High Power Heated Bed Expansion Power Module: Difference between revisions
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{{Header| MOSFET High Power Heated Bed Expansion Power Module}} | {{Header| MOSFET High Power Heated Bed Expansion Power Module}} | ||
== Specifications == | |||
1. Colour: Black | |||
2. Maximum current: 25A (enhanced heat dissipation) | |||
3. Size: about 6 x 5 x 3.1cm | |||
4. Mounting holes: 3.2mm diameter, for M3 screws | |||
== Features == | |||
- This module is positioned between the output of the heating bed or extruder and your electronic board as shown in the wiring diagram. | |||
- The white connector cable is provided. | |||
- With this additional module, the maximum current on the board can reach 25A. | |||
- This module is recommended if you plan to use a heated bed with a 3D printer that uses a 12V power supply. | |||
== Content == | |||
Simple - 1 MOSFET | |||
- 1 Cable | |||
Double - 2 MOSFET | |||
- 2 Cables | |||
- 2 Nozzles 0.4mm for wire of 1.75mm | |||
Package Included: [[https://www.banggood.com/MOSFET-High-Power-Heated-Bed-Expansion-Power-Module-MOS-Tube-for-3D-Printer-Prusa-i3-Anet-A8-or-A6-p-1356434.html?cur_warehouse=CN&rmmds=search]] | |||
Revision as of 13:23, 25 April 2021
| MOSFET High Power Heated Bed Expansion Power Module |
|
| https://bogza.ro/index.php/MOSFET_High_Power_Heated_Bed_Expansion_Power_Module | |
Specifications
1. Colour: Black 2. Maximum current: 25A (enhanced heat dissipation) 3. Size: about 6 x 5 x 3.1cm 4. Mounting holes: 3.2mm diameter, for M3 screws
Features
- This module is positioned between the output of the heating bed or extruder and your electronic board as shown in the wiring diagram. - The white connector cable is provided. - With this additional module, the maximum current on the board can reach 25A. - This module is recommended if you plan to use a heated bed with a 3D printer that uses a 12V power supply.
Content
Simple - 1 MOSFET
- 1 Cable
Double - 2 MOSFET
- 2 Cables
- 2 Nozzles 0.4mm for wire of 1.75mm
Package Included: [[1]]