MOSFET High Power Heated Bed Expansion Power Module
MOSFET High Power Heated Bed Expansion Power Module |
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https://bogza.ro/index.php/MOSFET_High_Power_Heated_Bed_Expansion_Power_Module |
Specifications
1. Colour: Black 2. Maximum current: 25A (enhanced heat dissipation) 3. Size: about 6 x 5 x 3.1cm 4. Mounting holes: 3.2mm diameter, for M3 screws
Features
- This module is positioned between the output of the heating bed or extruder and your electronic board as shown in the wiring diagram. - The white connector cable is provided. - With this additional module, the maximum current on the board can reach 25A. - This module is recommended if you plan to use a heated bed with a 3D printer that uses a 12V power supply.
Content
Simple - 1 MOSFET
- 1 Cable
Double - 2 MOSFET
- 2 Cables - 2 Nozzles 0.4mm for wire of 1.75mm
Package Included: [[1]]